Take SiEn Integrated Circuit Project as the industry leader to carry out precise investment promotion in the industrial chain. The introduction of R&D, design, manufacturing, packaging and testing of integrated circuits projects aims to develop industries related to the new generation of information technology represented by new high-performance integrated circuit, new type of flat panel display and Internet of Things.  Led by Dr. Zhang Rujing, China’s first CIDM integrated circuits project with total investment of 18.8 billion yuan is estimated to reach an annual output of about 4.6 billion yuan. Currently, the main building of the eight-inch chip factory has been completed. The total investment of Anrun Group reaches 180 million US dollars, with which a packaging, testing, design and R&D center with annual output value worth 1.8 billion yuan will be built. Leader-Tech Electronics mainly produces single-sided and double-sided ultra-high precision circuit COF CCL with annual output value worth 1.5 billion yuan. Hengtong blank CCL is invested by Hengtong Group, one of the top 100 private enterprises in China. DKK Semiconductor Chip is mainly engaged in R&D, production and testing of semiconductor chips and packaging. Progress is made with negotiations on cooperation in millimeter wave radar and medium and microchips.